🌡 Modular End-to-End Liquid Cooling Stack

KühlTherm
Precision
Cooling Systems For Data Centers & EV Infrastructure

KühlTherm designs and engineers proprietary hardware and software platforms for advanced thermal management, delivering substantial energy efficiency for mission-critical applications.

30-40%Efficiency
$350B+Market Context
70%Reduction
KühlTherm Liquid Cooling System
Live Cooling System — Active
Why KühlTherm

Engineered for Extreme Performance

Thermal solutions that redefine efficiency benchmarks — trusted by hyperscalers and enterprise data centers across India.

❄️
Ultra-Low PUE 1.03
Far exceeding industry standards of 1.5+, our immersion systems deliver the lowest power usage effectiveness in the market.
High-Density Ready
Handle server densities up to 200kW per rack — critical for AI/ML and GPU-heavy workloads that air cooling simply cannot manage.
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60% Carbon Reduction
Eliminate compressor-based cooling. Reduce your data center's carbon footprint significantly vs traditional air cooling systems.
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Modular & Scalable
Scale seamlessly from single racks to full facility deployments with our plug-and-play modular architecture.
Industry Applications

Engineered For Every Sector

Extending hardware lifespans and efficiency in the most demanding environments globally.

🧠
AI Training Clusters
Next-gen cooling for massive GPU clusters to prevent thermal throttling and maximize floating-point operations.
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High Performance Computing (HPC)
Direct liquid solutions designed specifically for supercomputing facilities demanding extreme density.
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Hyperscale Data Centers
Ultra-efficient thermal management to dramatically reduce facility PUE and hit key sustainability goals.
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Edge Compute Infrastructure
Compact, climate-hardened cooling for distributed IoT and edge servers deployed in harsh environments.
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Colocation Facilities
Flexible, retrofit-ready solutions scaling up to 100kW per rack instantly for high-density colocation tenants.
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EV Charging
High-power EV charger cooling enabling sustained 150–350kW output without thermal derating thresholds.
About KühlTherm

KühlTherm — Cooling Innovation
Made in India

What We Do
EST. 2025
💧
Liquid Cooling
Immersion, DLC & rear-door solutions
EV Thermal
High-power charger cooling systems
🏭
CDU Systems
Coolant distribution for data centers
🧠
AI Software
Predictive thermal analytics platform
30-40%
Energy Savings
100kW+
Per Rack
PUE 1.06
Target PUE

KühlTherm Pvt. Ltd.

Headquartered in Ahmedabad, Gujarat, India — a pioneer in advanced liquid cooling solutions for data centers and electric vehicle infrastructure since 2025.

2025Founded
AHMHQ

KühlTherm was founded with a singular mission: to make high-performance liquid cooling accessible to Indian data centers and global enterprises alike. We believe thermal inefficiency is the invisible enemy of compute performance — and we have dedicated ourselves to eliminating it.

Our team of thermal engineers, fluid dynamics specialists and data center architects work together to deliver end-to-end cooling infrastructure that reduces energy costs while maximising hardware performance and longevity.

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Precision Engineering
Every product designed to exacting tolerances for real-world environments.
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Partnership-First
We work as embedded partners — from design to deployment to long-term support.
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Sustainable Future
Our products dramatically reduce water and energy consumption vs legacy cooling systems.
Products & Solutions

Complete Liquid Cooling
Product Portfolio

Five cutting-edge product lines engineered for the highest thermal demands in data centers and EV infrastructure.

SINGLE-PHASE IMMERSION TANK
Immersion Cooling
Single-Phase Immersion
Servers submerged in dielectric fluid for direct, full-contact cooling. Eliminates fans entirely. Ideal for hyperscale deployments demanding maximum density.
200kW/rackPUE 1.03FanlessGPU Ready
CONDENSER TWO-PHASE IMMERSION
Immersion Cooling
Two-Phase Immersion
Dielectric fluid boils at chip surface and condenses passively. Maximum efficiency with no moving parts — the pinnacle of immersion cooling technology.
PassiveZero Moving PartsAI Ready
CPU GPU COLD PLATE MANIFOLD DIRECT LIQUID COOLING — COLD PLATE
Direct Liquid Cooling
DLC Cold Plate System
Precision liquid cold plates mount directly on CPUs and GPUs. Retrofit-compatible with existing rack infrastructure. Near-zero acoustic profile.
Retrofit-ReadyCPU & GPULow Noise
RDHx REAR-DOOR HEAT EXCHANGER
Rear-Door Heat Exchanger
RDHx ProSeries
Passive or active rear-door heat exchangers capture hot exhaust air and transfer it to chilled water. Plug-and-play installation — no facility downtime required.
Plug-and-Play30kW/rackPassive/Active
350 kW CHARGING ACTIVE EV CHARGER COOLING UNIT
EV Thermal Management
EV Charger Cooling Unit
Purpose-built liquid cooling for high-power EV charging stations (150–350kW). Prevents thermal derating, ensures consistent speeds in harsh Indian climates.
150–350kWIP6555°C Ambient
PUMP UNIT HEAT EX. FLOW CONTROL VALVE SENSORS CONTROLLER COOLANT DISTRIBUTION UNIT (CDU)
Custom Engineering
Custom CDU & Solutions
Bespoke coolant distribution units and custom thermal management systems designed for unique hardware configurations and facility constraints.
Custom DesignFull SupportScalable
Technology

How Our Cooling Technology Works

Deep-dive into the physics and engineering behind KühlTherm's three primary liquid cooling methodologies.

Proprietary Hardware + Software Platform

Advanced Cold Plate Engineering: Designed using computational fluid dynamics (CFD) optimization to maximize surface area exposure while maintaining manageable pressure drops.

Coolant Loop Optimization: Closed-loop systems incorporate flow-balanced manifolds, sensor arrays, and pressure regulation modules to maintain thermal stability.

AI-Optimized Control Algorithms: Continuous monitoring of temperature gradients, flow rates, and pressure differentials. Adaptive control logic modulates pump speed and coolant distribution in real time.

MEASURED PERFORMANCE IMPACT

  • Up to 70% higher energy efficiency
  • Higher rack power density
  • Improved Power Usage Effectiveness (PUE)
  • Extended semiconductor lifespan
  • Lower total cost of ownership
  • Reduced carbon intensity per compute unit

Immersion Cooling

Servers are submerged directly in a bath of non-conductive dielectric fluid. The fluid makes direct contact with all components, offering 1000× better thermal conductivity than air.

Dielectric Fluid ContactNon-conductive fluid bathes all server components directly
Heat Capture & RejectionHeated fluid circulates to an external heat exchanger for rejection
Zero Fan NoiseNo air-cooling fans — silent, low-vibration operation extends hardware life
Waste Heat ReuseCaptured heat can be reused for building heating or industrial processes
01
Servers submerged in dielectric bath at operating temperature
02
Fluid absorbs heat directly from CPUs, GPUs, PSUs, VRMs
03
Pump circulates hot fluid to an external heat exchanger
04
Cooled fluid returns — cycle continues with PUE ~1.03

Direct Liquid Cooling

Cold plates are mounted directly onto heat-generating components. Chilled water circulates through micro-channel cold plates, extracting heat precisely where it's generated.

Micro-Channel Cold PlatesPrecision-machined copper or aluminum plates optimized for each chip's TDP
Retrofit CompatibleIntegrates with existing server racks without facility modifications
Hybrid Air+LiquidHandles chip-level liquid cooling and residual air-cooling in one system
01
Cold plates mounted on CPU/GPU using thermal interface material
02
Chilled water enters through manifold at 18–25°C
03
Water exits warm at 35–45°C carrying chip heat away
04
Facility CDU rejects heat via dry cooler or cooling tower

Rear-Door Heat Exchanger

A heat exchanger replaces the standard rear door of a server rack. Hot exhaust air passes through chilled coils, dropping the exhaust temperature before it enters the data center aisle.

Zero Facility ChangesReplaces the existing rack door — no raised floor or structural modifications
Passive & Active ModelsPassive models use facility chilled water; active models have integral pumping
Up to 30kW Per RackHandles moderate-density racks without full immersion
01
Servers run normally with standard air cooling and fans
02
Hot air (~45°C) exits servers and hits the RDHx door coils
03
Chilled water in coils absorbs heat — air exits at ~20°C
04
Warm water returns to facility chilled water loop for rejection

EV Charger Thermal

High-power EV chargers generate intense heat in power electronics. Our system uses closed-loop liquid cooling to maintain IGBT modules, capacitors and busbars within safe temperature ranges.

IGBT Module CoolingDirect cold plate cooling for power semiconductors prevents derating
Climate HardenedOperates in ambient temperatures up to 55°C — built for Indian summers
Predictive MonitoringOnboard thermal sensors with remote monitoring and alert capabilities
01
Power electronics (IGBTs, rectifiers) generate heat at full load
02
Liquid cold plates bonded to high-power modules absorb heat
03
Integrated pump circulates coolant to compact heat exchanger
04
Air-cooled radiator rejects heat — no chilled water supply needed
System Architecture

Complete Cooling Infrastructure Stack

A layered architecture spanning from chip-level thermal interface to facility-wide heat rejection — every component engineered to work seamlessly together.

The Thermal Constraint in Modern Data Centers

Compute density has increased exponentially over the past decade. AI accelerators, GPUs, and high-performance CPUs now generate localized heat flux densities that exceed the practical removal capacity of air cooling systems.

Traditional CRAC/CRAH infrastructure is increasingly energy-intensive, mechanically complex, and spatially inefficient. As rack densities move beyond 30–50 kW and into 80–100 kW configurations, airflow-based heat transfer becomes insufficient due to fundamental convective limits.

Thermal bottlenecks now directly constrain compute performance, silicon longevity, and infrastructure scalability. Junction temperature control is no longer just a reliability metric, it is a performance enabler.

Liquid cooling is not a trend; it is a necessary architectural transition.

Layer 1 — Chip / Component Level
Source
🔲 CPU Cold Plates
🔲 GPU Cold Plates
💾 Memory Cooling
⚡ VRM Cooling
🔋 PSU Heat Mgmt
Layer 2 — Server / Rack Level
Distribution
🔀 Coolant Manifolds
🌊 Immersion Tanks
🚪 Rear-Door HX
🔌 Quick-Connect Fittings
📊 Flow Sensors
Layer 3 — Row / Room Level
Aggregation
🏭 CDU
💧 Primary Loop
🔄 Plate Heat Exchangers
💧 Expansion Tanks
🔧 Pressurization
Layer 4 — Facility Level
Rejection
🌬️ Dry Coolers
🧊 Adiabatic Coolers
🏗️ Cooling Towers
♻️ Waste Heat Recovery
🌊 Chilled Water Interface
Layer 5 — Monitoring & Control
Intelligence
📡 Thermal Sensors (IoT)
🖥️ DCIM Integration
📱 Remote Dashboard
🚨 Alert Systems
🤖 Predictive Analytics
📐
Design Philosophy
Every layer is designed for independence and redundancy. Failure in one layer does not cascade — ensuring N+1 thermal reliability across the entire infrastructure stack.
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Open Standards
KühlTherm systems conform to OCP, ASHRAE, and BICSI standards. Compatible with all major server OEMs — Dell, HPE, Lenovo, Supermicro, and custom builds.
📈
Scalability
Start with a single rack DLC deployment and scale to full-facility immersion without replacing infrastructure — our modular CDU architecture grows with you.
Resources

Resources & Insights

Stay ahead with our latest thinking on liquid cooling, data center design, and sustainable infrastructure.

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Blog Articles
Deep dives into cooling technology, GPU thermals, and data center design
3 ARTICLES
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Whitepapers
Technical guides, TCO analysis, and engineering specifications
COMING SOON
📬
Newsletter
Monthly engineering insights and product updates direct to your inbox
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Latest Insights

From the KühlTherm Blog

🧊
Liquid Cooling
Why Air Cooling Can't Keep Up with Modern GPUs

As GPU TDPs push past 700W, traditional air cooling hits hard physical limits. Here's what data center operators need to know about the transition to liquid.

📅 Coming Soon
EV Infrastructure
Thermal Management for 350kW EV Fast Chargers

High-power EV chargers generate enormous heat. We explore why liquid cooling is essential for sustained ultra-fast charging without derating.

📅 Coming Soon
📊
Data Centers
PUE Below 1.1 — How Liquid Cooling Gets You There

Achieving a PUE of 1.03–1.08 isn't a dream. We break down the real-world engineering behind ultra-efficient data center cooling architectures.

📅 Coming Soon
Downloads

Whitepapers & Technical Guides

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High-Density Liquid Cooling Optimization
A comprehensive guide to designing liquid cooling systems for 50–100kW racks. Covers CFD modeling, coolant selection, and manifold design.
Coming Soon
Subscribe to access →
📄
TCO Analysis: Air vs Liquid Cooling
5-year total cost comparison across immersion, DLC, and hybrid cooling architectures for enterprise data centers.
Coming Soon
Subscribe to access →
📄
EV Charger Thermal Design Guide
Engineering specifications for liquid-cooled EV charger systems supporting 150–350kW sustained output.
Coming Soon
Subscribe to access →

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Contact Us

Let's Build Your Cooling Solution

Talk to our Team. We'll assess your requirements and design a solution that fits your facility, budget, and timeline.

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Headquarters
Plot No. 37 Prabhu Estate, Ulariya Patia, Shantipura, Sarkhej - Sanand Rd, Sanathal, Ahmedabad, Gujarat 382210
📧
Email
sales@kuhltherm.com
📞
Phone
+917722079493
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Business Hours
Mon – Sat: 9:00 AM – 6:30 PM IST

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